Advanced design and manufacture II by Daizhong Su, Qingbin Zhang, Shifan Zhu

By Daizhong Su, Qingbin Zhang, Shifan Zhu

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G. power amplifiers and microprocessors. TE coolers consist of several p–n couples, which are sandwiched between two thermally conductive but electrically insulating ceramic plates. C. Xuan [3] to obtain simplified formulae at maxima for temperature difference, cooling rate and coefficient of performance. Compared numerically with real maximum cooling performances of TE coolers, simplified formulae are proved to be good approximations at small thermal contact resistance and not-too-short thermo elements.

A. Johnson: Electronics-cooling, article 2, 2005 August. E. J. C. Chu: ASME J. 76-84. 37 Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test Shiuh-Chuan Her1, a, Shien-Chin Lan1, Chun-Yen Liu1 and Bo-Ren Yao1 1 Dept. tw Keywords: drop test, finite element method, acceleration, impact response Abstract. Drop test is one of the common methods for determining the reliability of electronic products under actual transportation conditions. The aim of this study is to develop a reliable drop impact simulation technique.

Low, in Proc. 1270-1274. [2] E. 170. [3] Y. C. Ong, V. P. W. Shim, T. C. Chai and C. T. Lim, in 2003 Electronics Packaging Technology Conference, (2003), pp. 223-227. [4] M. C. Pan, P. C. Chen and J. Ho, in 2003 Electronics Packaging Technology Conference, (2003), pp. 269-274. [5] T. Y. Tee, H. S. Ng, C. T. Lim, E. Pek and Z. W. Zhong, Journal of Surface Mount Technology 16, (2003), pp. 31. [6] L. Zhu and W. Marcinkiewicz, IEEE Transaction on Components and Packaging Technologies 28, (2005), pp.

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